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SK
hynix showcases next-generation AI memory technologies beyond HBM
By Kim
Han-joo, Yonhap News Agency - SK hynix Inc. said Friday that it has showcased
its next-generation artificial intelligence (AI) memory technologies aimed at
expanding the boundaries of AI infrastructure beyond conventional
high-bandwidth memory (HBM).
The
company presented the technologies at the OCP Global Summit 2026, held in
California from Tuesday to Thursday (local time). The summit is an annual
conference organized by the Open Compute Project Foundation that brings
together engineers and industry leaders.
The
South Korean chip giant said it divided its exhibition space into two sections.
The
front section, dubbed the memory section, showcased the company's flagship
products, while the larger rear section, called the system demo section,
featured memory solutions designed to support next-generation server
ecosystems.
Kim
Ho-sik, a senior vice president at SK hynix, introduced MARS (Memory-Centric AI
Rack-Scale System), a disaggregated rack-scale architecture designed to
coordinate computing and memory resources seamlessly.
Kim
highlighted progress in High Bandwidth Flash (HBF), a technology aimed at
addressing the industry's growing demand for memory capacity.
The
company also unveiled its second-generation 256-gigabyte memory product based
on Compute Express Link (CXL) 3.2, offering more than twice the bandwidth of
its predecessor and an approximately 30 percent improvement in energy
efficiency.
Source: https://en.yna.co.kr/view/AEN20261016002500320?section=k-biz/index
