[News Article] SK hynix to offer bring memory, faster data processing with upcoming HBM4
SK
hynix to offer bring memory, faster data processing with upcoming HBM4 Korea JoongAng Daily
- SK hynix, the world's second-largest memory chipmaker, is developing
next-generation high bandwidth memory (HBM) to meet booming global demand
for artificial intelligence and
higher-performance computing, a senior executive said Tuesday. “Demand for
improvement in memory bandwidth is increasing following a spike in data traffic
in the era of AI and high-performance
computing,” Lee Kang-wook, head of package development at SK hynix, said during
a session at Semicon Taiwan, an annual international semiconductor exhibition,
in Taipei, Taiwan. “HBM has been widely
adopted as the memory product for AI servers and high-performance computing,”
he added. HBM is a
high-performance dynamic random access memory (DRAM) that is seeing high
demand, particularly via U.S. AI chip giant Nvidia's GPUs, which are key
components of AI computing. SK hynix is leading
the market with fifth-generation HBM3E. Its latest 12-layer HBM3E products are
scheduled for mass production in the third quarter. Lee also highlighted
that the company's sixth-generation HBM4 will offer higher memory capacity,
faster data processing speeds and improved efficiency compared with HBM3E due
to technological advancements such as the adoption of the logic process on the base
die. Technological and
performance improvements in HBM have fueled growing demand, particularly in the
generative AI market, which is projected to grow at an average rate of 27
percent between 2023 and 2032. As a result, the HBM market is expected to
expand by an average of 109 percent between 2022 and 2025. To keep pace, SK
hynix is focusing on packaging technologies, specifically mass reflow molded
underfill (MR-MUF). This technology, which SK hynix introduced with HBM2E in
2019, injects a liquid protective material between stacked chips, significantly
reducing heat. Building on MR-MUF
technology, SK hynix plans to ship 12-high HBM4 products next year and aims to
launch 16-high HBM4 products by 2026. In addition, SK
hynix announced plans to strengthen its cooperation with global tech giants,
such as Nvidia, Apple, Microsoft and Alphabet, to solidify its leadership
position in the HBM market. “SK hynix has also
been enhancing its collaboration with global partners in creating the ecosystem
to meet various customer demands in a more efficient way as customization
becomes a trend from HBM4E,” Lee said. Source:https://koreajoongangdaily.joins.com/news/2024-09-03/business/tech/SK-hynix-to-offer-bring-memory-faster-data-processing-with-upcoming-HBM4/2126736
2024.09.05
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